| 摘要 |
A method of inspecting semiconductor devices, wherein a plurality of semiconductor devices of the same type are successively connected to a measuring-inspecting means in a manner to be exchanged over from one to another, and pass or fail of the plurality of semiconductor devices is successively inspected by the measuring-inspecting section. According to this inspection method, at the first semiconductor device, as for a parallel inspection item or items which can be inspected simultaneously, out of inspection items of the plurality of semiconductor devices, said one measuring-inspecting means and the plurality of semiconductor devices are connected in parallel to inspect simultaneously, when the inspection of the parallel inspection item or items is passed, the inspection of the parallel inspection item or items at the time of inspecting the second semiconductor device and thenceforth is omitted, and, when the inspection of the parallel inspection item or items is not passed, each of the semiconductor devices is subjected again to the inspection of the parallel inspection item or items.
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