| 摘要 |
MOUNTING A COMPONENT TO A SUBSTRATE A method of mounting an optical component such as a laser chip (4) on a substrate (1) is described. The method comprises mounting the chip (4) on a bridge (9); and positioning the bridge (9) on the substrate (1). Locator means in the form of depending legs (10) are provided on the bridge (9) so that the bridge is located in the vertical direction relatively to the substrate (1) and hence the laser chip (4) is also located. Finally, the chip (4) is secured to the substrate (1) by, for example, soldering. |
