发明名称 FORMATION AND CORRECTION OF WIRING ON SUBSTRATE
摘要 <p>PURPOSE:To dispense with a pressure reducing device or a complicated device similar to this by partially carbonating a solid substance layer consisting of molecules which mainly contain carbon, in particular, molecules which contain benzene rings. CONSTITUTION:Metaphenilene diamine being the hardener and bisphenol A resin are kneaded at specified ratio, and those are applied on a glass substrate A and are hardened by heat. Moreover, polyimide resin on the market and PIQ are applied on another glass substrate B and are hardened by heat. Furthermore, naphthalene of reagent is loaded on one more different glass substrate C, and is dissolved by heat so as to obtain a naphthalene layer. Next, YAG laser beams of repeat frequency of 3kHz are converged on the substrate so as to scan it. The line of being carbonated black is recognized along the trace of scanning. The electric resistance on both sides of the carbonated line 20 micron in width and 200 micron in length is about 200 ohms.</p>
申请公布号 JPH036881(A) 申请公布日期 1991.01.14
申请号 JP19890141675 申请日期 1989.06.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TATEMICHI TOSHIO;YAMAGUCHI HISANORI;SUMIDA SHIROU;YAMAZOE HIROSHI
分类号 G02F1/1343;H01B5/00;H01B5/14;H01B13/00;H01C17/06;H05K1/16 主分类号 G02F1/1343
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