| 摘要 |
<p>PURPOSE:To realize compactness of a recording medium through reduction or circuit module and to enable reduction in manufacture time through simplification of a manufacture process by making a wire bonding direction of an integrated circuit chip in one specified direction. CONSTITUTION:In an IC card 1, a wire bonding direction of a wire 7 to connect a circuit module 3 and a printed substrate 6 is only in a longitudinal direction of a module substrate 4, and also led out from only one side 5a; therefore, it is possible to eliminate the necessity of arranging the printed substrate 6 to the other side 5b, an upper side 5c, or a lower side 5d of the module substrate 4, and to reduce both sizes W1, W2 of length and width of the module substrate 4 smaller than a conventional device, thereby realizing compactness of the IC card 1 itself. Furthermore, a moving amount of a bonding head during manufacture of the circuit module 3 is small as compared with a conventional one, thereby enabling reduction in manufacturing time of the IC card 1.</p> |
