| 摘要 |
PURPOSE:To contrive to improve the yield of a semiconductor device by a method wherein the regenerative work of the semiconductor device is easily performed by previously providing another region for wire junction in each wiring part and each chip. CONSTITUTION:In each lead 19, a junction region 21 in the same shape as that of a junction part 20 is provided at a region other than that of the junction part 20. In ordinary cases, the region 20 is used. In case of a regenerative work of the semiconductor device, the regenerative work can be simply performed by transferring the connection to the region 21. As other disposition examples are exemplified the following ones. The examples are ones that a pad 24 for rejunction is provided on the inner periphery of each ordinary junction pad 23, or a pad 26 for rejunction connected continuously to each of second-group ordinary junction pads 25C between ordinary junction pads 25A and 25B is provided. Besides these examples, there is an example that rejunction pads 27A and 27B are each provided at each of the pads 25A and 25B. Even this case is also effective for the regenerative work in the same manner as the cases in the above- mentioned examples. |
