| 摘要 |
PURPOSE:To surely join a conductive layer and a via together by a method wherein the via is made to protrude once from a ceramic board, the surface of the board is covered with an insulating layer, and then the insulating layer is removed to make the end of the via exposed again. CONSTITUTION:The surface of a ceramic board 1 is etched, a via 2 formed in the board 1 is made to protrude from an etched surface 3, and then an organic insulating layer 4 is deposited on the surface 3 covering the protruded via 2. Then, the insulating layer 4 is partly removed to enable the via 2 to be exposed again, and a conductive layer 5 is laminated on an exposed part 2A. Therefore, even if deep voids occur to the via 2, the voids are eliminated by the lamination of the insulating layer 4, so that voids 16A and 16B can be thoroughly eliminated without much polishing and the via 2 and the conductive layer 5 are surely joined together, and a ceramic board of this design can be improved in quality. |
