发明名称 DIELECTRIC, WHICH CAN BE FLATTENED
摘要 PURPOSE: To provide good flattening characteristics and insulation characteristics and enable structuring by constituting a dielectric by a base material of organic polymer having specific high-temperature stability. CONSTITUTION: A dielectric constituted by a base material of organic polymer of high-temperature stability where a solid filler capable of being etched in oxide plasma and having high thermal conductivity and good dielectric characteristics is embedded in a finely distributed state. The filler is up to 30vol.% in quantity and is advantageous in that the material is amorphous carbon containing hydrogen. Thereby, the dielectric has good flattening characteristics and insulation characteristics and low permittivity, low loss factor, and high thermal conductivity and can be also structured.
申请公布号 JPH034405(A) 申请公布日期 1991.01.10
申请号 JP19900111597 申请日期 1990.04.25
申请人 SIEMENS AG 发明人 JIIKUFURIITO BIRUKURE;ARUBERUTO HANMAASHIYUMITSUTO;YOHAN KANMAAMAIYAA;RAINAA ROISHIYUNAA;RORUFU BUEE SHIYURUTE
分类号 C08K3/04;C08K3/02;C08L79/04;C08L79/08;H01B3/00;H01B3/30;H01G4/20;H01L21/312;H01L23/29;H01L23/373 主分类号 C08K3/04
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