| 摘要 |
<p>PURPOSE:To obtain a device capable of sure surface mounting by making outer leads protruding from a package sealing a semiconductor chip and the like protrude on the same plane as the bottom surface of the package and in parallel to the bottom surface. CONSTITUTION:In a surface mounting type semiconductor device wherein a semiconductor chip 3 is mounted on a lead frame 1 and sealed in a package 6, from which outer leads 7 are made to protrude, the outer leads 7 are made to protrude on the same plane as the bottom surface of the package 6 and in parallel to the bottom surface. For example, inner leads 5 are bent step-wise in the vicinity of an element mounting part 2; the semiconductor chip 3 is mounted on the element mounting part 2 of the lead frame 1 wherein the outer leads 7 are arranged in parallel to the element mounting parts 2; the chip 3 is electrically connected with the inner leads 5 by using bonding wires 4. These are sealed with resin, thereby constituting the package 6. From the lower side peripheral part of the package 6, the outer leads 7 are made to protrude on the same plane as the bottom surface of the package 6 and in parallel to the bottom surface.</p> |
