| 摘要 |
<p>Wire contains 0.15% C and is treated at rolling heat, after having been subjected to controlled cooling after rolling. The wire is kept at a const. temp of 200-400 degrees C so that the interstitial atoms, which are supersaturated are to the controlled cooling assemble on other than dislocation sites so that the dislocations are not anchored and the loss of drawability due to the cooling is obviated. The wire is then wiredrawn without later heat-treatment to a very fine final dia. to prevent the thin non-adherent film of wustite formed during controlled cooling on the wire surface being decomposed into an adherent layer of higher oxide, which is difficult to eliminate after wiredrawing.</p> |
