| 摘要 |
<p>PURPOSE:To improve the thermal conductivity between an electrostatic chuck electrode and a water-cooled electrode and keep substrate at a lower temperature by fixing the electrostatic chuck electrode, which comprises two sheets of ceramic insulating substrate and conductive patterns therebetween which are formed integrally by sintering, to the water-cooled electrode by metallic bonding. CONSTITUTION:An electrostatic chuck electrode 3 comprises two conductive patterns 11a and 11b formed by depositing or applying such elements as Cu and Al to the inner face of front ceramic insulating substrate 10 of Al2O3, etc., sandwiched between ceramic insulating substrate 12, and sintered integrally. A cooling gas introduction hole 13 boring said electrode from the front to the rear is made. The electrostatic chuck electrode 3 is fit into the recess 4 of a water-cooled electrode 1 by metallic bonding 15 for integration and fixed. Therefore, electrostatically adsorbed substrate can be cooled with the water- cooled electrode 1 and cooling gas at the same time, safely processing substrate liable to be damaged by heat.</p> |
