HEAT-CONDUCTIVE COMPOSITE MATERIAL

摘要

A heat-conductive composite (10) usable as a substrate (heat sink) for semiconductor chip thereon or lead frame is provided, which comprises a metal sheet (11) of high thermal expansion at least one main surface of which has been laminated and integrated with a metal sheet (12) of low thermal expansion having a member of through-holes (13), a part of the metal sheet of high thermal expansion being exposed out to the surface (14) of the metal sheet of low thermal expansion through the through-holes thereof. Varying the thickness ratio of the respective constructional metal sheets and the surface area ratio of the exposed metal spots on the main surface, heat-conductive composite materials having any desired thermal expansion coefficient and thermal conductivity can be obtained.