| 摘要 |
PURPOSE:To prevent occurrence of paths in the bonded part by a method wherein a through hole is formed in a cover plate attached on a circuit board which includes semiconductor elements mounted thereon, and after bonding the cover plate the through hole is sealed by applying adhesives. CONSTITUTION:A cover plate 6 formed with a through hole 7 is attached on a circuit board 3 which includes semiconductor elements mounted thereon, using adhesives 8. After hardening th adhesives by heating, a plate 10 is mounted on the cover plate so as to close the through hole 7. Adhesives 11 such as solder is applied to seal the through hole in a hermetic state. By so doing, it becomes possible to prevent occurrence of air holes (paths) in the adhesives 8 upon rising in temperature during the process of bonding. Thus, hermetic sealing is ensured. |
