| 摘要 |
PURPOSE:To obtain a low cost device with high heat dissipating property by providing a heat dissipating segment which is made to branch from an inner lead or a tab lead and arranged almost vertically to a tab, and sealing a device en bloc by resin. CONSTITUTION:The title device is provided with the following; a semiconductor chip 2, a tab 3 mounting the semiconductor chip 2, inner leads 4a of a plurality of connection leads 4 whose tip parts are arranged in the vicinity of the periphery of the tab 3, and tab leads 7 for retaining the tab 3. Heat dissipating segments 6A, 6B are made to branch from the connection leads 4 or the tab leads 7, and bent almost vertically to the tab 3. Including the heat dissipating segments 6A, 6B, the device is encapsulated en bloc in a package. For example, a semiconductor chip 2 is fixed on the tab 3 of a lead frame 8; an electrode on the semiconductor chip 2 and a tip part of the inner lead 4a are connected by a bonding wire 5; then the inner leads 4a and the heat dissipating segments 6A, 6B of the tab leads 7 are bent upward by about 90 deg.. |
