| 摘要 |
PURPOSE:To enable wire bonding work under the same conditions, and obtain stable bonding strength, by setting the surface roughness on at least wire bonding side of conductor uniformly in all directions, in the manner in which irregularity of directivity is in a specified range. CONSTITUTION:On a heat dissipating plate 1, insulator 2, conductor 3 composed of copper and the like of superior electric and thermal conductivity, and a semiconductor chip 4 are laminated in order; the semiconductor chip 4 and the conductor 3 are bonded by using a wire 6; on the heat dissipating plate 1, a case surrounding the above insulator 2, conductor 3, semiconductor chip 4 is arranged; filler 9 Iike epoxy resin is buried in the case 7 and hardened. In such a semiconductor device, the surface roughness on at least the wire bonding side 3a of the conductor 3 is set uniformly in all direction, in the manner in which irregularity of directivity is in a specified range. For example, in order to uniformize the surface roughness of the surface 3a of the conductor 3, the polishing direction is made to cross or electropolishing is applied.
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