Method of packaging and powering integrated circuit chips and the chip assembly formed thereby.

摘要

An IC chip assembly (10), e.g. of the TAB-type, includes a chip (16) having an array of exposed contacts at a first face thereof, a substrate (12) having an array of exposed contacts at a face thereof and a compliant interposer (26) with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A heat transfer member (28) contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member.