| 摘要 |
PURPOSE:To reduce a loss time required for position correction and improve the efficiency of a bonding process by a method wherein detection by an individual lead position detector and the operation of a bonding part are performed in parallel in a wire bonder applied to the assembly process of a semiconductor element and the like. CONSTITUTION:A reference position detecting camera 2 fixed to bonding head 1 as a reference position detector is held on an X-Y table 6. The reference position detecting camera 2 detects the representing points of a chip and a lead. An individual lead position detecting camera 5 is attached to a position before bonding and the detection of the position of each lead and an operation (including the reference position detection) at a bonding part are processed in parallel at independent positions. The individual lead position detecting camera 5 is held on an X-Y table 7 which is different from the X-Y table 6 on which the reference position detecting camera 2 is held. The bonding operation is performed at the bonding position between a chip 10 on a stage 8S and wires 9 and between the wires 9 and respective leads formed in a lead frame 8. |
