发明名称 THERMAL SEAL DEVICE
摘要 PURPOSE:To heat a material to be sealed quickly and heat-bond at high speed by adopting the electromagnetic heating method in a heating device. CONSTITUTION:A thermal seal device 10 is constituted of a heating device 12 for heating a plurality of forms 11 and a couple of pressing rollers 13, upper and lower, and pressure bonding seal requiring section of forms 11 in the heated state. The heating device 12 is constituted of a microwave oscillator 12A and a couple of heating electrodes 12B, upper and lower. The forms 11 are heated by developing heat by means of dielectric loss (molecular friction loss in a dielectric material) generated by placing a heating electrode 12B of the heating device 12 in an electric field of high frequency or microwave, and then fed into a pressure roller 13 and pressurized in the state of being heated and bonded. Therefore, a material to be heated is quickly heated by a compact device structure and can be heat-bonded at a high speed.
申请公布号 JPH031931(A) 申请公布日期 1991.01.08
申请号 JP19890134728 申请日期 1989.05.30
申请人 TOSHIBA SEIKI KK 发明人 SUZUKI HISAYA
分类号 B65B51/10;B29C65/04;B29C65/14 主分类号 B65B51/10
代理机构 代理人
主权项
地址