| 摘要 |
<p>PURPOSE:To dispense with a large number of parts and to omit assembling labor by a method wherein a printed circuit board is received in a conductive packing member and the almost whole of this packing material is covered with a surface base part and a rear base part both of which are integrally molded each other. CONSTITUTION:The first packing member 20 composed of a cylindrical insulating heat-shrinkable tube is provided so as to receive a printed circuit board 2 to cover the entire surface thereof by heat shrinkage, and the second packing member 2 composed of a cylindrical conductive heat-shrinkable tube is provided so as to receive the substrate 2 covered with the member 20 to cover the same by heat shrinkage in the same way as the member 20. Further, a base part 22 is integrally molded so as to cover almost all of the substrate 2 received in the members 20, 21 to constitute an IC card. In this case, the surface state of the substrate 2 becomes smooth by covering the substrate 2 with the members 20, 21 and, even when the base part is molded from a resin, no sink is generated. By using the conductive heat-shrinkable tube in the member 21, the static electricity charged at the certain region of the base part 22 is escaped.</p> |
