发明名称 |
Process for producing a carrier tape |
摘要 |
A process for producing a cheap carrier tape of a two layer structure having a superior heat resistance, difficultly susceptible of effect of impurities and having a superior flexibility is provided, which process comprising the following steps: coating a polyimide varnish onto a continuous, electrically-conductive metal foil and baking it; punching the resulting tape of a two layer structure of the metal foil and the polyimide film to form sprocket holes; cutting and removing the polyimide film to form a device hole; coating a resist onto the metal foil surface; light-exposing the resulting resist by the medium of a mask for separating a circuit pattern and a circuit from the sprocket parts; developing the resulting resist and etching the metal foil by the medium of a mask of the resist; removing the resist; and plating the metal foil.
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申请公布号 |
US4982495(A) |
申请公布日期 |
1991.01.08 |
申请号 |
US19890437635 |
申请日期 |
1989.11.17 |
申请人 |
CHISSO CORPORATION |
发明人 |
OKAMOTO, MASAMITSU;WADA, MASAMI;FUNIKAWA, HIDENORI;KATO, HARUO;SHOUJI, HIDEAKI |
分类号 |
H01L21/60;H01L21/48;H05K3/00;H05K3/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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