| 摘要 |
PCT No. PCT/SE90/00434 Sec. 371 Date Dec. 27, 1991 Sec. 102(e) Date Dec. 27, 1991 PCT Filed Jun. 19, 1990 PCT Pub. No. WO91/01045 PCT Pub. Date Jan. 24, 1991.The device is intended for application by oven soldering of covers on semiconductor capsules (1) when they are still held in a fixture (2) used in a previous manufacturing step. A cover portion (3), which is applied, has a centering means (30) for centering a semiconductor capsule (1) in relation to a cover (4) hanging in a permanent magnet in the cover portion (3). After the cover portion is in place and during heating, a pusher (6) of memory metal will after changing shape press the cover (4) into place on the capsule (1) where it is soldered in place. |
