| 摘要 |
PURPOSE:To increase the number of thick film resistors to be placed on a multilayer board and to enhance the mounting density of the board by forming a polymer thick film dielectric on a cermet thick film resistor formed on an alumina board or the cermet thick film dielectric, and then forming a polymer thick film resistor. CONSTITUTION:After a polymer thick film dielectric 6 is formed on a cermet thick film resistor 5 formed on an alumina board 1 or a cermet thick film dielectric 2, a polymer thick film resistor 8 is formed. If the dielectric 6 overcoated with the resistor 5 and a cermet thick film outer layer conductor 4 is used as it is, it is not necessary to separately provide a step of forming the overcoating material of the resistor 5 and the conductor 4. |
