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经营范围
发明名称
HEATER CHIP FOR THERMOCOMPRESSION BONDING
摘要
申请公布号
JPH03486(A)
申请公布日期
1991.01.07
申请号
JP19890137048
申请日期
1989.05.29
申请人
MURATA MFG CO LTD
发明人
MATSUDA SHUZO
分类号
B23K20/00
主分类号
B23K20/00
代理机构
代理人
主权项
地址
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