| 摘要 |
<p>Chemical copper plating using tertiary amine promoters. Increased stability and plating rates are obtained by adding small amount of a promoter with 3-10 stability constant for complexes with Cu(II)-ions, pref. a t-amine, more pref. 0.7 mg/l triethanolamine, to electroless Cu plating solution, used particularly for printed circuits, containing a source of Cu(II)-ions, complexing agent for Cu(II)-ions a reducing agent and a base for adjusting pH.</p> |
