发明名称 |
Method and apparatus for cooling an integrated circuit chip during testing |
摘要 |
A method and apparatus for testing integrated circuit devices includes a cooling chuck which is extensible within a bore in a cooling chuck body to a position in thermal contact with the integrated circuit device. The temperature of the cooling chuck is regulated by a fluid cooling system, which can be set to operate at a selected capacity to maintain the integrated circuit device at a desired temperature during testing.
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申请公布号 |
US4982153(A) |
申请公布日期 |
1991.01.01 |
申请号 |
US19890307259 |
申请日期 |
1989.02.06 |
申请人 |
CRAY RESEARCH, INC. |
发明人 |
COLLINS, DAVID R.;FRANZ, PERRY D.;TAYLOR, PAMELA W. |
分类号 |
G01R31/28 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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