| 摘要 |
A plating apparatus of a plating liquid injection type comprises a plating bath, which is filled with plating liquid, for accommodating a plurality of block-like works, plating liquid injection mechanisms disposed at opposite sides of the works for injecting the plating liquid toward the works, the plating liquid injection mechanisms including a plurality of plating liquid injecting portions which are spaced from each other and are adjustable at injection angles thereof, an overflow tank arranged outside the plating bath for collecting the plating liquid overflowed from the plating bath, and a plating liquid returning mechanism including a pump and connecting the overflow tank to the plating liquid injection mechanism, the plating bath being adapted to foam a storage tank for storing the plating liquid when the pump stops.
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