ULTRA-TALL INDIUM OR ALLOY BUMP ARRAY FOR IR DETECTOR HYBRIDS AND MICRO-ELECTRONICS

摘要

Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips (42,44) in a hybrid detector array assembly. The individual tubes (34) of prior art interconnect pads are filled with indium and are then etched away to leave indium columns (40) of increased height, relative to the indium bumps (46) that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.