| 摘要 |
<p>A heat sink mounting for a semi-conductor device includes a base member having a base body defining a generally cylindrical recess and a downwardly extending stem portion. The base body further defines an annular groove extending around the side surface of the cylindrical recess. A cap member detachably engages the base member and encloses the cylindrical recess. The cap member includes a tab arrangement which extends radially outward from the bottom of the cylindrical side wall of the cap member to engage the annular groove.</p> |
