发明名称 SEMICONDUCTOR DEVICE AND LEADFRAME USED FOR ASSEMBLING SAID SEMICONDUCTOR
摘要 PURPOSE:To prevent the separation of wire bonding parts, by forming buffer parts whose strength is partially weak in inner leads. CONSTITUTION:The wire bonding parts 12 are formed at the tips of the inner leads 2 of two leads 1 on both sides. Protruded parts 3 which are hooked to a resin are provided on the 3 inner leads 2. The thin buffer parts 13 whose strength is the weakest are provided on the inner leads 2 of the 2 leads for wire bonding. When an external force is applied to the lead 1, the lead is not pulled out since the hooking part of each inner lead 2 is hooked to the resin. Since the strength of the buffer parts 13 for the inner leads 2 is weak, they are extended and deformed by the external force and absorb the external force.
申请公布号 JPS57192055(A) 申请公布日期 1982.11.26
申请号 JP19810076538 申请日期 1981.05.22
申请人 HITACHI SEISAKUSHO KK 发明人 ENOMOTO USUKE;INABA KEIZOU
分类号 H01L23/48;H01L21/60;H01L23/495;H01L23/50 主分类号 H01L23/48
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