发明名称 RESIN COMPOSITION FOR LAMINATE
摘要 PURPOSE:To prepare a resin compsn. used for a laminate and excellent in the heat resistance, mechanical strengths, and adhesive properties by compounding a compsn. obtd. by compounding a specific polyfunctional epoxy resin with a bismaleimide compd.-arom. diamine condensate with a specific linear polymer. CONSTITUTION:A resin compsn. for a laminate is prepd. by compounding 100 pts.wt. compsn. (A) obtd. by compounding 100 pts.wt. polyfunctional epoxy resin of formula I (wherein (m)/(n) is 1 to 10 or (n)=0; and (a) is 1 or 2) with a mol.wt. of 1000 to 3000, obtd. by glycidylating a polycondensate of a mixture of a brominated bisphenol A with bisphenol A or the brominated bisphenol A only with formaldehyde, with 10 to 40 pts.wt. condensate obtd. by reacting one mol of a bismaleimide compd. with 0.2 to 1.3mol of an arom. diamine; and 1 to 60 pts.wt. linear polymer (B) having a mol.wt. of 5000 to 100000 and compatible with compsn. A (e.g. polysulfone, polyethersulfone, or polyester).
申请公布号 JPH02311550(A) 申请公布日期 1990.12.27
申请号 JP19890132244 申请日期 1989.05.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHAMA TAKASHI;NAKAJIMA HIROYUKI;OKA SEIJI;NONOGAKI MITSUHIRO;KIKUCHI TAKUMI;ADACHI EINOSUKE
分类号 B32B15/08;B32B15/092;C08G59/00;C08G59/20;C08G59/30;C08G59/32;C08G59/40;C08G59/62;C08L63/00;H05K1/03 主分类号 B32B15/08
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