| 摘要 |
PURPOSE:To improve the resolution and mass-productivity of an ultrasonic diagnostic device, an ultrasonic inspection device and an ultrasonic microscope or the like by forming a diaphragm part whose thickness is formed thin onto a Si wafer and providing a piezoelectric vibration film onto the diaphragm part. CONSTITUTION:A diaphragm part 3 whose thickness is formed thin film is formed to a Si wafer 2 and a piezoelectric vibration film 7 is provided onto the diaphragm part 3. Since the piezoelectric vibration film 7 can be formed very thin by the sputtering method or the like, the oscillation at an ultrahigh frequency is attained by selecting the film thickness ratio of the piezoelectric vibration film 7 and the diaphragm 3. Thus, the resolution of a device such as an ultrasonic diagnostic device, an ultrasonic inspection device and an ultrasonic microscope is improved and the mass-productivity is improved. |
