发明名称 |
LAMINATING RESIN COMPOSITION |
摘要 |
PURPOSE:To obtain the subject composition excellent in heat resistance, mechanical strengths and adhesiveness by blending a composition formed by mixing a specified polyepoxy resin with a brominated bisphenol A in a specified mixing ratio with a linear polymer compatible with this composition in a specified mixing ratio. CONSTITUTION:100 pts.wt. composition formed by mixing a polyepoxy resin (A) of formula I with a brominated bisphenol A (B) of formula II (wherein a is 1 to 4) in such a mixing ratio as to give 0.7 to 1.2 equivalents of the hydroxyls of B per equivalent of the epoxy terminals of A is mixed with 1 to 60 pts.wt. linear polymer (e.g. phenoxy resin) or an MW of 5000 to 100000 compatible with this composition. |
申请公布号 |
JPH02311518(A) |
申请公布日期 |
1990.12.27 |
申请号 |
JP19890134101 |
申请日期 |
1989.05.26 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
TAKAHAMA TAKASHI;NAKAJIMA HIROYUKI;OKA SEIJI;NONOGAKI MITSUHIRO;KIKUCHI TAKUMI;FUTAKUCHI MICHIO |
分类号 |
B32B15/092;B32B15/08;B32B27/38;C08G59/00;C08G59/20;C08G59/32;C08G59/62;C08L63/00;H05K1/03 |
主分类号 |
B32B15/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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