发明名称 LAMINATING RESIN COMPOSITION
摘要 PURPOSE:To obtain the subject composition excellent in heat resistance, mechanical strengths and adhesiveness by blending a composition formed by mixing a specified polyepoxy resin with a brominated bisphenol A in a specified mixing ratio with a linear polymer compatible with this composition in a specified mixing ratio. CONSTITUTION:100 pts.wt. composition formed by mixing a polyepoxy resin (A) of formula I with a brominated bisphenol A (B) of formula II (wherein a is 1 to 4) in such a mixing ratio as to give 0.7 to 1.2 equivalents of the hydroxyls of B per equivalent of the epoxy terminals of A is mixed with 1 to 60 pts.wt. linear polymer (e.g. phenoxy resin) or an MW of 5000 to 100000 compatible with this composition.
申请公布号 JPH02311518(A) 申请公布日期 1990.12.27
申请号 JP19890134101 申请日期 1989.05.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHAMA TAKASHI;NAKAJIMA HIROYUKI;OKA SEIJI;NONOGAKI MITSUHIRO;KIKUCHI TAKUMI;FUTAKUCHI MICHIO
分类号 B32B15/092;B32B15/08;B32B27/38;C08G59/00;C08G59/20;C08G59/32;C08G59/62;C08L63/00;H05K1/03 主分类号 B32B15/092
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