| 摘要 |
PURPOSE:To reduce the dimensional deformation of a green sheet generated when conductor paste is screen printed on the sheet and to manufacture a highly integrated ceramic multilayer circuit board by forming a thin organic binder film on the surface of the sheet before a through hole is formed after the sheet is formed, and pressing it. CONSTITUTION:A green sheet 1 on a carrier film 3 fed from a drying furnace 5A is coated with organic binder solution 6 by a spray 7, passed again through a drying furnace 5B, and an organic binder film having a thickness of 2mum is formed on the surface of the sheet 1. Further, the sheet 1 is interposed between mold release films 8 coated on the surfaces with silicone resin, pressed by a pressure plate 9, thereby making the thickness of the organic binder film uniform. 110,000 through holes 14 each having 100mum of diameter are pressed on a region having 100mm X 100mm of the sheet 1 by a punch 10, a screen 11 is placed on the sheet 1, conductor paste 12 is pressed by a squeegee 13, and the paste 12 is filled in the holes. |
