| 摘要 |
PURPOSE:To use an aluminum plate as an intermediate plate by so superposing a one-side copper-plated outer layer material formed by sequentially laminating a copper foil layer, a resin-immersed base material layer having small softness at a high temperature and a normal resin immersed base material layer on both outermost layers of a multilayer printed circuit board via coating cloth that the copper foil becomes an outermost layer, further alternately superposing the above structure and an aluminum intermediate plate, and thermally press-molding it. CONSTITUTION:A one-side copper-plated outer layer material 4 is formed by disposing a resin immersed base material layer 2 adjacent to a copper foil 1 and having small softness at a high temperature and further a normal resin immersed base material layer 3 adjacently thereto. The material 4 is superposed on both outermost layers of an inner layer circuit board 6 via coating cloths 5 as a 4-layer plate 9. The composed plate 9 is interposed to be held between disposable aluminum plates 8 to be stacked. Then, it is thermally press molded by a press via a jig plate 7 to obtain a multilayer printed circuit board. As a result that resin softness at the time of pressing is small, even if the aluminum plate of the soft material is used, no uneven part is formed on the surface of the copper foil. |
