发明名称 WIRE BONDING
摘要 PURPOSE:To prevent a wire from being bung down by a method wherein a tension is caused at the wire in a prescribed section, the wire is drawn out while the wire is being bent downward at an exit of a drawing-out nozzle and the rear surface of the wire is being rubbed by the drawing-out nozzle. CONSTITUTION:When a wire guide 21 has been raised to a prescribed height, a brake shoe 27 is brought into contact with a brake disk 26 and a tension is caused at a wire 23. While the wire guide 21 is being raised further, it is moved sideways. During this process, the wire 23 is bent downward at a corner of a drawing-out nozzle 24 and is rubbed at its rear surface. As a result, a curly tendency is produced at the wire 23. When the wire bas reached the upper part of a second bonding point 12, the brake disk 26 is fixed firmly so as not to be turned in a reverse direction; also a clamp 25 is closed; the wire guide 21 is lowered. During this process, the wire 23 draws an upward protruding arc. The wire 23 is bonded to the second bonding point 12 by using a bonding tool 20.
申请公布号 JPH02310938(A) 申请公布日期 1990.12.26
申请号 JP19890132056 申请日期 1989.05.25
申请人 SANYO ELECTRIC CO LTD 发明人 NAKAMURA MASABUMI;KANAKUBO MASARU
分类号 H01L21/60 主分类号 H01L21/60
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