| 摘要 |
<p>PURPOSE:To assure higher throughput and high accurate alignment by separating the whole of a wafer carrying part from an XY stage and an exposure body part such as a projection lens. CONSTITUTION:Robot hands 8, 10 an a prealignment stage 9 in a wafer carrying part are mounted on a base platen 6 on the side of a body through a body side carrying system support part 16. Alternatively, wafer cassettes 11, 12 and a robot 22 are not mounted on the body side base platen 6 but mounted on a carrying system base 17. Accordingly, even though in a unit placed on the carrying system base 17, vibration, if any, is produced, it does not affect the body side base platen 6, thereby permitting a wafer to be carried in and out at a high speed without a severe vibration measure. Hereby, there are assured a fine line width, highly accurate alignment, and higher throughput.</p> |
