发明名称 |
Method of die bonding semiconductor chip by using removable non-wettable by solder frame |
摘要 |
A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A removable non-wettable by solder frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
|
申请公布号 |
US4979289(A) |
申请公布日期 |
1990.12.25 |
申请号 |
US19890309425 |
申请日期 |
1989.02.10 |
申请人 |
HONEYWELL INC. |
发明人 |
DUNAWAY, THOMAS J.;SPIELBERGER, RICHARD K.;DICKS, LORI A. |
分类号 |
H01L21/58;H01L21/60 |
主分类号 |
H01L21/58 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|