| 摘要 |
<p>PURPOSE:To provide a resin composition achieving a low stress without deteriorating its heat resistance, flowability, etc., and useful for sealing electronic parts by compounding a poly-arylene sulfide resin with a specific amount of (graft-modified) poly (4-methyl-1-pentene) resin, etc. CONSTITUTION:A resin composition for sealing electric parts comprises (A) a polyarylene sulfide resin, (B) poly (4-methyl-1-pentene) resin and/or a modified poly (4-methyl-1-pentene) resin graft-modified with an unsaturated carboxylic acid (derivative) in a graft amount range of 0.01-10wt.%, (C) a reinforcing and/or a filler and (D) an organic silane in an A/B weight ratio of 99/1-86/14 in an (A+B) content of >=25wt.%, a C content of 74.99wt.% and a D content of 0.01-5%. The resin composition has a melt viscosity of <=300 poises at 320 deg.C. The component C includes that having an aspect ratio of >=50 or that having an average particle side of >=300mum in an amount of <=20wt.% based on the whole composition.</p> |
