| 摘要 |
PURPOSE: To strongly combine a bump to a pad by pressing an indium bump to a gold bond pad for a short time for temporary fusion for press-contact and then perfectly alloying the indium bump with the gold bond pad. CONSTITUTION: An indium bump 11 is alloy-bonded with a gold pad 20 by pressing for about 10 seconds at a pressure about 800 pounds per 1 square inch. The pressure temporarily fuses two components, and the fused indium bump 11 and gold pad 20 are heated at about 100 deg.C for about one hour. By this heating, gold is diffused in indium for forming diffusion-welding. Thus, alloyed bond of high strength is provided. |
