| 摘要 |
<p>PURPOSE:To prevent reliably the occurrence of cracks and the like in the side surfaces of diaphragms by a method wherein after grooves for element division use of a prescribed depth are formed in the rear of a silicon substrate, the bottom parts of these grooves for element division use are removed by etching. CONSTITUTION:In a silicon substrate W set with a multitude of element regions 5,..., which constitute an acceleration sensor, grooves 6,... for element division use of a prescribed depth are formed in the side of the rear of the substrate W along the longitudinal and lateral directions using a dicing saw. Then, by boring graspingly the side of the rear of this substrate W by etching, a recessed part 2 for diaphragm use is formed in each region 5 and at the same time, the bottom parts of the grooves 6 formed using the dicing saw are removed up to reach the side of the surface of the substrate W. Whereupon, the regions 5,... set on the substrate W are respectively divided individually with the removal of these bottom parts. Thereby, a crack and a break are never generated in the side surfaces of diaphragm 3 in the acceleration sensor 1 formed into a single item.</p> |
