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经营范围
发明名称
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE
摘要
申请公布号
JPH02305453(A)
申请公布日期
1990.12.19
申请号
JP19890127108
申请日期
1989.05.19
申请人
MITSUBISHI ELECTRIC CORP
发明人
OBARA MASANOBU;TADA TETSUO
分类号
H01L21/60;H01L23/04;H01L23/12
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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