| 摘要 |
PURPOSE:To enable inner boards not to be positionally deviated from each other in a lamination process by a method wherein prepregs around a fixing member are removed, and spacers formed of rigid material are arranged in place of the prepregs. CONSTITUTION:Prepregs 2 around and eyelet 4 are removed, and rigid spacers 5 are arranged in place of the prepregs 2. Therefore, the prepregs 2 to which heat and pressure are applied are melted to bond an outer board 1 to an inner board 3 or the inner boards 3 together, and at this point, as the rigid spacer 5 arranged around the eyelet 4 in place of the prepreg 2 which is melted by hot press, the eyelet 4 is never deformed. By this setup, a multilayer printed wiring board high in accuracy where inner boards are not positionally deviated from each other can be obtained. |
