发明名称 |
TREATMENT FOR COPPER FOIL |
摘要 |
An improved treatment for copper foil that is to be used for lamination to a board comprises electrodepositing a dendritic layer of copper on the side of the foil that is to be laminated to the board. The dendritic layer is secured by electrodepositing a gilding layer of copper over it. A barrier layer is next electrodeposited over the gilding layer. The barrier layer is formed by means such as electrodeposition from a solution containing ions of zinc, nickel and antimony. This in turn is covered with an anticorrosion layer that is formed of chromates or phosphates, disposed over the barrier layer. |
申请公布号 |
CA1277948(C) |
申请公布日期 |
1990.12.18 |
申请号 |
CA19860512542 |
申请日期 |
1986.06.26 |
申请人 |
SQUARE D COMPANY |
发明人 |
WOLSKI, ADAM M.;CHENG, CHINTSAI T.;SIMON, RICHARD B.;GAMBHIRWALA, MANOJ C. |
分类号 |
H05K3/38;C25D3/56;C25D5/10;C25D5/16;C25D7/06 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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