| 摘要 |
<p>PURPOSE:To enable miniaturization and high density mounting by inserting a single in-line type ROM into a socket fixed in a hole of a substrate, and arranging a microcomputer and the like in a sealing space. CONSTITUTION:A socket 16 is fixed in a hole 4 of an integrated circuit substrate so as to be connected with a desired conducting path: an EPROM of a resin molded single in-line type ROM is inserted so as to be detachable; the EPROM can be taken out from the socket 16, and free rewriting is enabled by using ultraviolet rays. On the other hand, a microcomputer 7, a circuit element 8, etc., are arranged in the sealing space 21 side on case material of a substrate. By this constitution of effective space utilization, a hybrid integrated circuit device is miniaturized, and high density mounting is realized.</p> |
