| 摘要 |
PURPOSE:To obtain a printed-wiring board whose interlayer bonding property is excellent and whose halo-resistant property is good by a method wherein laminated bodies where a circuit-copper surface of an inner-layer material is plated with copper containing titanium, a eutectoid of titanium and copper is precipitated and an outer- layer material is arranged, vis a prepreg layer on the surface of the inner-layer material, at an outermost layer are laminated, molded and united. CONSTITUTION:Laminated bodies where a circuit-copper surface is plated with copper containing titanium, a eutectoid of fine uneven titanium and copper is precipitated on the circuit-copper surface and an outer-layer material composed of a one-sided metal-clad laminated sheet or a metal foil is arranged at an outermost layer via the required number of prepregs composed of a resin and a base material on the surface of an inner-layer material are laminated, molded and united by using a multistage press method, a multiroll method, a double-belt method, a drum method, a nonpressure continuous heating method or the like. For plating with copper containing titanium, the copper containing a titanium compound such as titanium tartrate, potassium hydrogentitanate or the like is plated. It is preferable to contain 0.0001 to 0.01mol/l of titanium ions. |
