| 摘要 |
PURPOSE:To obtain a multilayer printed-wiring board whose hole processing property and heat-resistant property are excellent by a method wherein laminated bodies where outer-layer materials are arranged on the surface and/or the rear surface of an inner- layer material including a nonwoven base material via prepregs are laminated and united. CONSTITUTION:Laminated bodies where outer-layer materials are arranged on the surface and/or the rear surface of an inner-layer material including a nonwoven base material are laminated and united. As the inner-layer material, a base material including at least one layer of the nonwoven base material such as an inorganic fiber nonwoven cloth such as a glass nonwoven cloth, a sheet of glass paper or the like, an organic synthetic nonwoven cloth such as a polyester, a polyamide, a polyvinyl alcohol, a polyacryl or the like is impregnated with a resin varnish composed of a single substance, a denatured substance or a mixed substance of a phenolic resin, a cresol resin, an epoxy resin or the like to which a filler such as calcium carbonate, aluminum hydroxide or the like is added; this assembly is dried. Metal foils are arranged on the surface and/or the rear surface on which the required number of prepregs is piled up; they are united; after that, electric circuits are formed on the metal foils. |
