发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To make a drive circuit effective only during bonding by providing a CPU to a controller to operate the drive circuit and giving commands to feed wires after setting an actuator to a state of operation. CONSTITUTION:When a state feeding wires is obtained by controlling a CPU 2 in a controller 1, for example, instructions are given to a drive circuit 3 only when its operation is incorporated into bonding sequence. Then the sensing state of a touch sensor 5 makes an actuator 4 operate. And during the stopping of bonding, the CPU 2 makes the drive circuit 3 become ineffective compulsorily. In this way, the circuit 3 becomes effective only when bonding is in operation and the actuator 4 feeds the wires. This step prevents wastage of the wires and saves the time required for repairs due to a loose and careless operation, and stable feeding of the wires is performed.
申请公布号 JPH02303039(A) 申请公布日期 1990.12.17
申请号 JP19890123303 申请日期 1989.05.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWABATA KAZUHIRO
分类号 H01L21/60 主分类号 H01L21/60
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