CARRIER JIG FOR SEMICONDUCTOR SUBSTRATE HOUSING JIG

摘要

PURPOSE:To decrease dust attached to a housing jig and a substrate and improve the manufacturing yield by providing a layer for prevention against static electricity to a contact face between a carrier jig and the substrate housing jig made of a resin so that the above layer consists of the same kind of resin as one used in the above housing jig. CONSTITUTION:Suspending a housing jig 2 of a semiconductor substrate, a carrier jig 1 is formed with rustless steel and quartz and the like. A layer for prevention against static electricity which consists of the same kind of resins as those forming the jig 2 is formed at a contact face between jigs 1 and 2 and then, its layer prevents generation of static electricity caused by contact friction. The formation of this layer exceedingly reduces dust attained to the housing jig and the substrate and improves the manufacturing yield.