| 摘要 |
<p>PURPOSE:To cut a wafer without exerting adverse influence upon the element forming region of a chip by a method wherein, after grinding is performed with a first grinding tool thinner than a specified width, grinding is performed with a second whetstone having a specified width and grains smaller than those of the first grinding tool. CONSTITUTION:Grinding is performed with a first grinding tool 6 thinner than the width of a specified cutting groove. Next only the thickness of a difference part of groove width is subjected to grinding with a second grinding tool 7 whose thickness is equal to the width of the cut groove. As a result, the processing resistance between a semiconductor wafer and the second grinding tool 7 is extremely reduced, and the generation of such chipping that exerts adverse influence upon the element forming region of a chip can be avoided.</p> |
