摘要 |
PURPOSE:To enhance the manufacturing yield of a stamper while eliminating bulging and delamination at the time of electroforming by irradiating a photosensitive resin layer with light after the developing process of said resin layer. CONSTITUTION:A photosensitive resin layer is formed to the surface of a glass substrate and pref. prebaked. Subsequently, exposure and development are performed but exposure is performed by laser beam modulated by a signal source and the exposed photosensitive resin layer is further developed to form a pattern. At the proper point of time after this developing process, the photosensitive resin layer is irradiated with light such as ultraviolet rays, visible light or laser beam. As the light, it is pref. to use ultraviolet rays and, after irradiation, nickel or silver is applied to the photosensitive resin layer usually in a film thickness of about 500-1500Angstrom by sputtering to perform conductivity imparting treatment. By this irradiation with light after the developing process, a release phenomenon at the time of electroforming is prevented. |