| 摘要 |
PURPOSE:To prevent the plating deposition to cathode pins and the generation of conduction failure by a method wherein a plating device is provided with liquid-guard walls. CONSTITUTION:Points of contact of cathode pins 3 in the periphery of a wafer 2 are provided with photo resist apertures 2a, which are made as plating cathode lead-out parts. On the other hand, the plating device is provided with liquid- guard walls 5 so that the pins 3 do not come into contact with the overflown plating liquid, at the parts where the pins 3 project out of the upper end outer periphery 6 of the plating bath into the bath, in the outer end outer periphery 6 to which the plating liquid of the plating bath overflows. At the time of installing this wafer 2 to the plating device, the wafer 2 is overlapped with the walls 5 in such a manner that its apertures 2a do not contact the plating liquid, so that the pins 3 may abut against the apertures 2a. This manner allows no deposition of plating to the pins 3 and does not generate plating failure due to poor conduction of the wafer 2 with the pins 3. |
